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Intel is staffing a single integration leader to own hybrid bonding and 3D chip stacking from lab development through high-volume manufacturing, signaling that packaging-level 3D integration has become a core bet for regaining process leadership rather than a side capability.
About the Role
Lead the integration and execution of next-generation hybrid bonding and 3DIC technologies, taking complex semiconductor technology from development through qualification, manufacturing ramp, and high-volume production.
This is a highly visible technical leadership role responsible for bringing together process development, yield, manufacturing, quality, product engineering, and business teams. You will solve complex integration challenges, drive critical technology decisions, manage execution risk, and ensure successful delivery against performance, yield, reliability, schedule, and customer commitments.
Responsibilities
Required Skills and Experience
Preferred Skills and Experience
We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.
Annual Salary Range for jobs which could be performed in the US: $248,400.00-350,690.00 USD
The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.
Work Model for this Role
This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. * Job posting details (such as work model, location or time type) are subject to change.*
ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.
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