Advanced Packaging Development Engineer
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Key details
Why this role is notable
Apple is building in-house advanced 2.5D/3D packaging capability (hybrid bonding, TSVs, interposers) and pulling it into its own product development rather than relying solely on outside packaging suppliers, signaling a bet on custom silicon integration as a competitive lever.
Job Description
Apple’s Advanced Packaging team is seeking an experienced Packaging Development Engineer to drive next-generation packaging integration and technology development for future products. In this role, you will lead the definition, development, and qualification of cutting-edge 2.5D and 3D packaging technologies—incorporating features such as hybrid bonding, high-density interposers, fine-pitch microbumps, and Through-Silicon Vias (TSVs).
You will work cross-functionally with silicon design, physical design, SI/PI, thermal, and manufacturing teams to guide technologies from early architecture exploration through qualification and high-volume manufacturing.
